Leadframe based packaging
Available: SOP, SOJ, SSOP, VSOP, TSSOP, QFP, LQFP, TQFP, TO, PLCC, BGA etc.
Services: Package Design, Chip Probing, Assembly and Final Test.
Gerber Layout Design
By using PADS software to do the Gerber layout design.
Layout with care for the location of parts to satisfy the EMI/EMC
issues and also fit the best enclosure layout etc.
Product housing/enclosure design with software of Solidworks,
AutoCAD and Pro-E to work on the designing.
Rigid PCB up to 22 layers and Flex PCB up to 6 layers
with HDI, Epoxy plugging + Cu plating over. Heavy copper
up to 5oz and Aluminum/Copper based materials.
BOM file setup with correct component’s part number,
spec, value, description and footprints.
Molding, Plastic Injection, Die Casting, Metal Stamping,
Metal Sheet Bending & Cutting etc.
PCB Assembly Production
Components are assembly with the process of SMT, DIP
and backend soldering with final AOI check and visual inspection.
PCBA Function Test
The test for the board after components are assembly.
The test will follow the requirements (SOP),
tools and equipment’s to perform and accomplish this process.
PCBA assembly with the required enclosures, accessories
and tools to accomplish this process.
Performing the product final function testing based on the testing
requirements (SOP), also performing the final inspection before
packing per requirements (SOP).
Packing and labeling are to meet the requirements for shipment.
Such as product with ESD bag plus double set of cartons for protection.
Product is able to ship from Taiwan to anywhere of world by sea or air freight,
we have logistic partners to accomplish the shipping process.